IEC 60749-32
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 32: Flammability of plastic-encapsulated devices (externally induced) CORRIGENDUM 1
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| Organization: | IEC |
| Publication Date: | 1 August 2003 |
| Status: | inactive |
| Page Count: | 13 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
November 1, 2010
Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
Scope and object
This part of IEC 60749 is applicable to semiconductor devices (discrete devices and integrated circuits).
The object of this test is to determine whether the device ignites due to...
July 1, 2010
AMENDMENT 1 Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.
IEC 60749-32
August 1, 2003
SEMICONDUCTOR DEVICES – MECHANICAL AND CLIMATIC TEST METHODS – Part 32: Flammability of plastic-encapsulated devices (externally induced) CORRIGENDUM 1
A description is not available for this item.
August 1, 2002
Semiconductor devices – Mechanical and climatic test methods – Part 32: Flammability of plastic-encapsulated devices (externally induced)
A description is not available for this item.