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IEC 60068-2-54

Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method

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Organization: IEC
Publication Date: 1 April 2006
Status: inactive
Page Count: 24
ICS Code (Electronic components in general): 31.020
ICS Code (Environmental testing): 19.040
scope:

This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference testing and for components that cannot be quantitatively tested by other methods. For surface mounting devices (SMD), IEC 60068-2-69 should be applied if it is suitable.

This standard provides the standard procedures for solder alloys containing lead (Pb) and for lead-free solder alloys.

 

Document History

IEC 60068-2-54
April 1, 2006
Environmental testing – Part 2-54: Tests – Test Ta: Solderability testing of electronic components by the wetting balance method
This part of IEC 60068 outlines Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability. It is especially suitable for reference...
January 1, 1985
Basic Environmental Testing Procedures Part 2: Tests Test Ta: Soldering Solderability Testing by the Wetting Balance Method
A description is not available for this item.

References

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