IPC - TM-650 22.214.171.124
Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
|Publication Date:||1 August 1998|
This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results may be affected by the process conditions.