IPC - TM-650 2.6.16.1
Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 August 1998 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated constructions, the results may be affected by the process conditions.
Document History
TM-650 2.6.16.1
August 1, 1998
Moisture Resistance of High Density Interconnection (HDI) Materials Under High Temperature and Pressure (Pressure Vessel)
This test method is designed to determine the capability of HDI materials and other dielectrics to withstand moisture induced stress as applied by extended time in a pressure vessel. For laminated...