DLA - SMD-5962-88641 REV A
MICROCIRCUIT, LINEAR, UNIVERSAL DUAL FILTER, MONOLITHIC SILICON
| Organization: | DLA |
| Publication Date: | 7 January 1994 |
| Status: | inactive |
| Page Count: | 12 |
scope:
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".
The complete PIN shall be as shown in the following example:
The device type(s) shall identify the circuit function as follows:
Device type Generic number Circuit function 01 LTC1060A Universal dual filter building block 02 LTC1060 Universal dual filter building block
The case outline(s) shall be as designated in MIL-STD-1835 and as follows:
Outline letter Descriptive designator Terminals Package style R GDIP1-T20 or CDIP2-T20 20 Dual-in-line
The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein). Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.
Supply voltage (VS) . . . . . . . . . . . . . . . . . . . 18 V dc Power dissipation (PD) . . . . . . . . . . . . . . . . . 500 mW Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Junction temperature (TJ) . . . . . . . . . . . . . . . . +150°C Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (ΘJC) . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (ΘJA) . . . . . . l00°C/W
Supply voltage (VS) . . . . . . . . . . . . . . . . . . . ±5 V dc Ambient operating temperature range (TA) . . . . . . . . −55°C to +125°C
intended Use:
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.
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