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IEC 61189-5

Test methods for electrical materials, interconnection structures and assemblies – Part 5: Test methods for printed board assemblies

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Organization: IEC
Publication Date: 1 August 2006
Status: inactive
Page Count: 68
ICS Code (Printed circuits and boards): 31.180
scope:

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.

 

Document History

IEC 61189-5
August 1, 2006
Test methods for electrical materials, interconnection structures and assemblies – Part 5: Test methods for printed board assemblies
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.  

References

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