IECQ - QC 760201
Semiconductor Devices - Integrated Circuits - Part 22-1: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
inactive, Most Current
| Organization: | IECQ |
| Publication Date: | 1 April 1997 |
| Status: | inactive |
| Page Count: | 17 |
Document History
QC 760201
April 1, 1997
Semiconductor Devices - Integrated Circuits - Part 22-1: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
A description is not available for this item.
January 1, 1991
Semiconductor Devices Integrated Circuits Part 22: Section One: Blank Detail Specification for Film Integrated Circuits and Hybrid Film Integrated Circuits on the Basis of the Capability Approval Procedures
A description is not available for this item.