AFNOR - NF EN 60191-6-4
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
active, Most Current
| Organization: | AFNOR |
| Publication Date: | 1 November 2003 |
| Status: | active |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
NF EN 60191-6-4
November 1, 2003
Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
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