IPC - TM-650 2.4.23

Soldering Resistance of Laminate Materials

active, Most Current
Organization: IPC
Publication Date: 1 March 1979
Status: active
Page Count: 2
scope:

This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin, scorching, delamination, blistering and measling are considered in the evaluation.

Document History

TM-650 2.4.23
March 1, 1979
Soldering Resistance of Laminate Materials
This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin,...

References

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