IPC - TM-650 2.4.23
Soldering Resistance of Laminate Materials
|Publication Date:||1 March 1979|
This test method is used to determine the resistance of laminate materials (both unclad and etched surfaces) to the thermal abuse of a solder dip. Resistance to softening, loss of surface resin, scorching, delamination, blistering and measling are considered in the evaluation.