NPFC - MIL-M-38510/662
MICROCIRCUITS, DIGITAL, HIGH SPEED, CMOS DATA SELECTORS/MULTIPLEXERS, MONOLITHIC SILICON
| Organization: | NPFC |
| Publication Date: | 31 March 1988 |
| Status: | active |
| Page Count: | 21 |
scope:
This specification covers the detail requirements for monolithic silicon, high speed, CMOS, logic microcircuits. Two product assurance classes and a choice of case outlines and lead finishes are provided and are reflected in the complete part number.
The part number shall be in accordance with MIL-M-38510, and as specified herein.
The device types shall be as follows:
Device type Circuit
01 Eight-input data selector/multiplexer
The device class shall be the product assurance level as defined in MIL-M-38510.
The case outlines shall be designated as follows:
Outline letter Case outline (see MIL-M-38510, appendix C) E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package X C-1 (16-terminal, .308" × .308" × .100"), square chip carrier package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document should be addressed to: Rome Air Development Center AFSC, RADC/RBE-2, Griffiss AFB, NY 13441-5700, by using the self-addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this document or by letter.
Supply voltage (VCC) - - - - - - - - - - - - - −0.5 V dc to + 7.0 V dc DC input voltage (VIN) - - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc DC output voltage (VOUT) - - - - - - - - - - - −0.5 V dc to VCC +0.5 V dc Clamp diode current (IIK, IOK)- - - - - - - - - ±20 mA DC output current per pin (IOUT): Device types 01 through 04 - - - - - - - - - ±25 mA Device types 05 through 07 - - - - - - - - - ±35 mA DC VCC or GND current per pin (ICC): Device types 01 through 04 - - - - - - - - - ±50 mA Device types 05 through 07 - - - - - - - - - ±70 mA Storage temperature range (TSTG) - - - - - - - −65°C to + 150°C Maximum power dissipation (PD) - - - - - - - - 300 mW Lead temperature (soldering, 10 seconds) - - - +300°C Thermal resistance junction-to-case (θJC): Cases E, F, R, S, X, and 2 - - - - - - - - - See MIL-M-38510, appendix C Junction temperature (TJ)- - - - - - - - - - - +175°C
Input low (VIL) maximum voltage: VCC = 2 V- - - - - - - - - - - - - - - - - - 0.3 V VCC = 4.5 V- - - - - - - - - - - - - - - - - 0.9 V VCC = 6 V- - - - - - - - - - - - - - - - - - 1.2 V Input high (VIH) minimum voltage: VCC = 2 V- - - - - - - - - - - - - - - - - - 1.5 V VCC = 4.5 V- - - - - - - - - - - - - - - - - 3.15 V VCC = 6 V- - - - - - - - - - - - - - - - - - 4.2 V Case operating temperature range (TC)- - - - - −55°C to +125°C Input rise and fall times (tr, tf) maximum: VCC = 2 V- - - - - - - - - - - - - - - - - - 1,000 ns VCC = 4.5 V- - - - - - - - - - - - - - - - - 500 ns VCC = 6 V- - - - - - - - - - - - - - - - - - 400 ns
intended Use:
Microcircuits conforming to this specification are intended for original equipment design application and logistic support of existing equipment.
Document History