Standard Test Method for Separating an Ionizing Radiation-Induced MOSFET Threshold Voltage Shift into Components Due to Oxide Trapped Holes and Interface States Using the Subthreshold Current-Voltage Characteristics
|Publication Date:||10 May 1998|
|ICS Code (Transistors):||31.080.30|
This test method covers the use of the subthreshold charge separation
technique for analysis of
ionizing radiation degradation of a gate dielectric in a
Procedures are given for measuring the MOSFET subthreshold current-voltage characteristics and for the calculation of results.
The application of this test method requires the MOSFET to have a substrate (body) contact.
Both pre- and post-irradiation MOSFET subthreshold source or drain curves must follow an exponential dependence on gate voltage for a minimum of two decades of current.
The values given in SI units are to be regarded as standard. No other units of measurement are included in this test method.
This standard does not purport to address all of the safety concerns, if any, associated with its use. It is the responsibility of the user of this standard to establish appropriate safety and health practices and determine the applicability of regulatory limitations prior to use.
Footnote 2 - For formulation of subthreshold charge separation technique see McWhorter, P. J. and P. S. Winokur, "Simple Technique for Separating the Effects of Interface Traps and Trapped Oxide Charge in MOS Transistors," Applied Physics Letters, Vol 48, 1986, pp. 133-135.
Footnote 3 - DNA-TR-89-157, Subthreshold Technique for Fixed and Interface Trapped Charge Separation in Irradiated MOSFETs, available from National Technical Information Service, 5285 Port Royal Rd., Springfield, VA 22161.
Footnote 4 - Saks, N. S., and Anacona, M. G., "Generation of Interface States by Ionizing Radiation at 80K Measured by Charge Pumping and Subthreshold Slope Techniques," IEEE Transactions on Nuclear Science, Vol NS-34, No. 6, 1987, pp. 1348-1354.