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DLA - SMD-5962-92314 REV B

MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 22 August 1995
Status: inactive
Page Count: 23
scope:

This drawing forms a part of one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class N RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ABT543 Octal latched transceiver with dual enable, three-state outputs, TTL compatible inputs. 02 54ABT543A Octal latched transceiver with dual enable, three-state outputs, TTL compatible inputs.

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835, and as follows:

Outline letter Descriptive designator Terminals Package style K GDFP2-F24 or CDFP3-F24 24 Flat package L GDIP3-T24 or CDIP4-T24 24 dual-in-line 3 CQCC1-N28 28 Leadless-chip-carrier package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage range (VCC) - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC input voltage range (VIN) (except I/O ports) - - - - −0.5 V dc to +7.0 V dc 4/ DC input voltage range (VIN) (I/O ports) - - - - - - - −0.5 v dc to +5.5 V dc 4/ DC output voltage range (VOUT) - - - - - - - - - - - - - −0.5 V dc to +5.5 v dc 4/ DC input clamp current (IIK) (VIN < 0.0 V ) - - - - - - −18 mA DC output clamp current (IOK) (VOUT < 0.0 V) - - - - - - −50 mA DC output current (IOL) (per output): Device type 01 - - - - - - - - - - - - - - - - - - - - +96 mA Device type 02 - - - - - - - - - - - - - - - - - - - - +128 mA Storage temperature range (TSTG) - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - - +300 C Thermal resistance, junction-to-case (ΘJC) - - - - - - - See MIL-STD-1835 Junction temperature (TJ) - - - - - - - - - - - - - - - +150°C Maximum power dissipation (PD) - - - - - - - - - - - - - 500 mW

Supply voltage range (VCC) - - - - - - - - - - - - - - - +4.5 v dc to +5.5 V dc Input voltage range (VIN) - - - - - - - - - - - - - - - +0.0 V dc to VCC Output voltage range (VOUT) - - - - - - - - - - - - - - +0.0 V dc to VCC Maximum low level input voltage (VIL) - - - - - - - - - 0.8 V Minimum high level input voltage (VIH) - - - - - - - - - 2.0 V Case operating temperature range (TC) - - - - - - - - - −55°C to +125°C Maximum input rise and fall rate (Δt/ΔV) - - - - - - - - 5 ns/V Maximum high level output current (IOH) - - - - - - - - −24 mA Maximum low level output current (IOL) - - - - - - - - - 48 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - XX percent 5/

intended Use:

Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes.

Microcircuits... View More

Document History

October 19, 2022
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. Replaceability....
April 22, 2021
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead...
October 27, 2014
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
October 7, 2008
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes...
March 31, 1997
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing forms a part of one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space...
SMD-5962-92314 REV B
August 22, 1995
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing forms a part of one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space...
August 19, 1994
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and...
January 15, 1993
MICROCIRCUIT, DIGITAL, ADVANCED BIPOLAR CMOS, OCTAL LATCHED TRANSCEIVER WITH DUAL ENABLE, THREE-STATE OUTPUTS, TTL COMPATIBLE INPUTS, MONOLITHIC SILICON
This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M),...
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