scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes Q and M) and space application (device class V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device class M RHA marked devices shall meet the MIL-I-38535 appendix A specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 82C88/7 Latchup resistant, CMOS, bus controller

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style R CDIP2-T20 20 Dual-in-line package

The lead finish shall be as specified in MIL-STD-883 (see 3.1 herein) for class M or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage (V_CC) - - - - - - - - - - - - - - - - - - - - - - +8.0 V dc Input or I/0 voltage range - - - - - - - - - - - - - - - - - - - GND −0.5 V dc to V_CC +0.5 V dc Storage temperature range (T_STG) - - - - - - - - - - - - - - - - −65°C to +150°C Thermal resistance, Junction-to-case (Θ_JC) - - - - - - - - - - - 12°C/W Thermal resistance, Junction-to-ambient (Θ_JA) - - - - - - - - - - 68°C/W Maximum package power dissapation at T_A = +125°C (P_D) 2/- - - - - 0.74 W Junction temperature (T_J) - - - - - - - - - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds) - - - - - - - - - - - - +275°C

Operating supply voltage range (V_DD) - - - - - - - - - - - - - - 4.5 V dc to +5.5 V dc Operating temperature range (T_A) - - - - - - - - - - - - - - - - −55°C to +125°C Input low voltage range(V_IL) - - - - - - - - - - - - - - - - - - 0 V dc to +0.7 V dc Input high voltage range, except clock pin (V_IH) - - - - - - - - 2.2 V dc to V_DD Input high voltage range, clock pin (V_IHC) - - - - - - - - - - - V_DD − 0.8 to V_DD

intended Use: