BSI - BS EN 60068-2-69
Environmental testing Part 2: Tests Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
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| Organization: | BSI |
| Publication Date: | 15 August 1996 |
| Status: | inactive |
| Page Count: | 22 |
| ICS Code (Environmental testing): | 19.040 |
scope:
Describes the solder bath wetting balance and globule wetting balance methods of test. Both are applicable to components with metallic terminations and metallized solder pads. To be read in conjunction with BS EN 60068-1:1995
Document History
July 31, 2017
Environmental testing Part 2-69 - Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
A description is not available for this item.
July 31, 2017
Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
A description is not available for this item.
July 31, 2017
Environmental testing Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
A description is not available for this item.
July 31, 2007
Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
A description is not available for this item.
BS EN 60068-2-69
August 15, 1996
Environmental testing Part 2: Tests Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
Describes the solder bath wetting balance and globule wetting balance methods of test. Both are applicable to components with metallic terminations and metallized solder pads. To be read in...
References
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