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IPC - TM-650 2.3.31

Relative Degree of Cure in U.V. Curable Materials

inactive, Most Current
Organization: IPC
Publication Date: 1 February 1988
Status: inactive
Page Count: 2
scope:

This test method is designed to determine relative degree of cure in liquid U.V. curable materials such as etch resists, plating resists and solder masks. It is not applicable to dry film products nor to solvent-based thermal cure products.

Document History

TM-650 2.3.31
February 1, 1988
Relative Degree of Cure in U.V. Curable Materials
This test method is designed to determine relative degree of cure in liquid U.V. curable materials such as etch resists, plating resists and solder masks. It is not applicable to dry film products...

References

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