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JEDEC JEP 130

Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing

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Organization: JEDEC
Publication Date: 1 August 1997
Status: inactive
Page Count: 11

Document History

February 1, 2023
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container.
November 1, 2016
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
This document establishes the guidelines for unit container packing of integrated circuits and for the next level of container.
February 1, 2006
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)
This document establishes guidelines for integrated circuit unit container and the next level (intermediate) container packing and labeling. The guidelines include tube/rail standardization,...
JEDEC JEP 130
August 1, 1997
Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing
A description is not available for this item.
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