UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

DLA - SMD-5962-88778

MICROCIRCUIT, CMOS, 12-BIT BUFFERED MULTIPLYING, DIGITAL TO ANALOG CONVERTER, MONOLITHIC SILICON

inactive
Organization: DLA
Publication Date: 18 May 1989
Status: inactive
Page Count: 11
scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function 01 (See 6.4) CMOS 12-bit buffered multiplying DAC 02 (See 6.4) CMOS 12-bit buffered multiplying DAC

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

VDD to DGND - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +17 V dc Supply voltage range- - - - - - - - - - - - - - - - - - - +5 V dc to +15 V dc VREF to GND - - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to +17 V dc Digital input voltage to DGND - - - - - - - - - - - - - - −0.3 V dc to VDD VRFB, VREF to DGND- - - - - - - - - - - - - - - - - - - - ±25 V dc VOUT to DGND- - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to VDD AGND to DGND- - - - - - - - - - - - - - - - - - - - - - - −0.3 V dc to VDD Power dissipation (PD) Up to +75°C - - - - - - - - - - - - - - - - - - - - 450 mW Derates above +75°C - - - - - - - - - - - - - - - - 6 mW/°C Storage temperature range - - - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds)- - - - - - - - - +300°C Thermal resistance, junction-to-case (θJC)- - - - - - - - See MIL-M-38510, appendix C Thermal resistance, junction-to-ambient (θJA): Case R- - - - - - - - - - - - - - - - - - - - - - - - - 120°C/W Case 2- - - - - - - - - - - - - - - - - - - - - - - - - 110°C/W Junction temperature (TJ) - - - - - - - - - - - - - - - - +150°C

Operating ambient temperature range (TA)- - - - - - - - - −55°C to +125°C Reference voltage (VREF)- - - - - - - - - - - - - - - - - +10 V dc Supply voltage- - - - - - - - - - - - - - - - - - - - - - +15 V dc

intended Use:

Microcircuits conforming to this drawing are intended for use when military specifications do not exist and qualified military devices that will perform the required function are not available for... View More

Document History

October 15, 2002
MICROCIRCUIT, CMOS, 12-BIT BUFFERED MULTIPLYING, DIGITAL TO ANALOG CONVERTER, MONOLITHIC SILICON
A description is not available for this item.
SMD-5962-88778
May 18, 1989
MICROCIRCUIT, CMOS, 12-BIT BUFFERED MULTIPLYING, DIGITAL TO ANALOG CONVERTER, MONOLITHIC SILICON
This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices"....
Advertisement