scope:

This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN is as shown in the following example:

Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) identify the circuit function as follows:

Device type Generic number Circuit function 01 320C80-50 Multimedia video processor

The device class designator is a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Q or V Certification and qualification to MIL-PRF-38535

The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style X P-CK 305 Pin grid array Y (See figure 1) 320 1/ Ceramic quad flatpack with non- conductive tie bar

The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M.

Supply voltage range (V_DD) ................................−0.3 V dc to +4.0 V dc Input voltage range (V_IN) .................................−0.3 V dc to +4.0 V dc Output voltage range (V_OUT) ...............................−0.3 V dc to +4.0 V dc Storage temperature range (T_STG) ..........................−55°C to +150°C Thermal resistance, junction-to-case(θ_JC) Case X ......................................................1.4°C/W Case Y ......................................................2°C/W Maximum power dissipation (P_D) ..................... ........8.6 W Junction temperature (T_J)............................ .......175°C

Supply voltage range (V_DD)..................................3.135 V dc to 3.465 V dc Supply voltage range (V_SS)..................................0 V dc to 0 V dc Case operating temperature range (T_C).......................−55°C to +125°C High level output current (I_OH).............................−400 μA Low level output current (I_OL)..............................2 mA

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) ...............XX percent 2/

intended Use: