UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - TM-650 2.5.10.1

Insulation Resistivity for Adhesive Interconnection Bonds

active, Most Current
Organization: IPC
Publication Date: 1 November 1998
Status: active
Page Count: 2
scope:

The purpose of this test method is to quickly assess the adequacy of a given Anisotropically Conductive Adhesive Film (ACF) construction and bonding process for avoiding short circuits between adjacent traces of a flex circuit being bonded to a low profile circuit substrate.

Purpose ACF materials are often used to interconnect fine-pitch flexible circuitry to substrates such as flat-panel displays. A center to center pitch range of 80 μm to 200 μm is not uncommon in circuits for flat panel display applications. It is critical that the particle dispersion within the ACF be of sufficient quality such that there is no inherent tendency for short circuits between adjacent traces. In addition, it is important that a bonding process is used, which doesn't create any undue accumulation of particles, which will lead to short circuits.

Document History

TM-650 2.5.10.1
November 1, 1998
Insulation Resistivity for Adhesive Interconnection Bonds
The purpose of this test method is to quickly assess the adequacy of a given Anisotropically Conductive Adhesive Film (ACF) construction and bonding process for avoiding short circuits between...

References

Advertisement