IPC - TM-650 184.108.40.206
Insulation Resistivity for Adhesive Interconnection Bonds
|Publication Date:||1 November 1998|
The purpose of this test method is to quickly assess the adequacy of a given Anisotropically Conductive Adhesive Film (ACF) construction and bonding process for avoiding short circuits between adjacent traces of a flex circuit being bonded to a low profile circuit substrate.
Purpose ACF materials are often used to interconnect fine-pitch flexible circuitry to substrates such as flat-panel displays. A center to center pitch range of 80 μm to 200 μm is not uncommon in circuits for flat panel display applications. It is critical that the particle dispersion within the ACF be of sufficient quality such that there is no inherent tendency for short circuits between adjacent traces. In addition, it is important that a bonding process is used, which doesn't create any undue accumulation of particles, which will lead to short circuits.