AFNOR - NF EN 60749-19
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength
active
| Organization: | AFNOR |
| Publication Date: | 1 August 2003 |
| Status: | active |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
August 1, 2011
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength
A description is not available for this item.
NF EN 60749-19
August 1, 2003
Semiconductor devices - Mechanical and climatic test methods - Part 19 : die shear strength
A description is not available for this item.