scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and M) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of radiation hardness assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function Multiply time 01 TMC2009 12 × 12 bit CMOS multiplier/accumulator 170 ns 02 LMA1009/2009 12 × 12 bit CMOS multiplier/accumulator 95 ns 03 LMA1009/2009 12 × 12 bit CMOS multiplier/accumulator 65 ns 04 LMA1009/2009 12 × 12 bit CMOS multiplier/accumulator 55 ns

The device class designator shall be a single letter identifying the product assurance level as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 O or V Certification and qualification to MIL-I-38535

For device classes M, B, and S, case outline(s) shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q and V, case outline(s) shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X D-13 (64-lead, 3.240" × .920" × .225"), dual-in-line package Y C-7 (68-terminal, .962" × .962" × .120"), square leadless chip carrier package Z C-J5 (68-terminal, .960" × .960" × .135"), square grid chip carrier package unformed lead option only U P-AC (68-pin, 1.180" × 1.180" × .345"), square pin grid array

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Supply voltage- - - - - - - - - - - - - - - - - - - - - −0.5 to +7.0 V Input voltage - - - - - - - - - - - - - - - - -- - - - - −0.5 to (V_DD + 0.5) V Output: Applied voltage 3/ - - - - - - - - - - - - - - - - - −0.5 to (V_DD +0.5) V Forced current 4/ 5/- - - - - - - - - - - - - - - - - −3.0 mA +6.0 mA Temperature: Operating, case - - - - - - - - - - - - - - - -- - - - −60°C to +130°C Operating, junction- - - - - - - - - - - - - - - - - - +175°C Lead, soldering (10 seconds)- - - - - - - - - - - - - +300°C Storage- - - - - - - - - - - - - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation, unloaded 6/ Device type 01 - - - - - - - - - - - - - - - - - -- - 330 mW Device types 02, 03, and 04 - - - - - - - - - -- - - 138 mW Thermal resistance, junction-to-case (Θ_JC): Cases X, Y, Z, U - - - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C

Supply voltage (V_DD) - - - - - - - - - - - - - - - - 4.5 V ≤ V_DD ≤ 5.5 V Input voltage, logic low (V_IL)- - - - - - - - - - - - 0.8 V Input voltage, logic high (V_IH) - - - - - - - - - - - 2.0 V Case temperature (T_C) - - - - - - - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - - - XX percent 7/

intended Use: