scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device types shall identify the circuit function as follows:

Device type Generic number Circuit function t_PD 01,05,09 C16L8 16-input 8-output AND-OR invert logic array 40,30,20 ns 02,06,10 C16R8 16-input 8-output registered AND-OR logic array 40,30,20 ns 03,07,11 C16R6 16-input 6-output registered AND-OR logic array 40,30,20 ns 04,08,12 C16R4 16-input 4-output registered AND-OR logic array 40,30,20 ns

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060"× .310" .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package X C-2A (20-terminal, .358" × .358" × .075"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc DC voltage applied to outputs in High Z- - - - - - - −0.5 V dc to +7.0 V dc DC input voltage - - - - - - - - - - - - - - - - - - −3.0 V dc to +7.0 V dc Output sink current- - - - - - - - - - - - - - - - - 24 mA Thermal resistance, junction-to-case (θ_JC): See MIL-M-38510, appendix C Maximum power dissipation (P_D) 1/ - - - - - - - - - 1.0 W Maximum junction temperature (T_J) - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum) - - +260°C Storage temperature range - - - - - - - - - - - - - −65°C to +150°C Temperature under bias range - - - - - - - - - - - - −55°C to +125°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High-level input voltage (V_IH) - - - - - - - - - - - 2.0 V dc minimum Low-level input voltage (V_IL)- - - - - - - - - - - - 0.8 V dc maximum Case operating temperature range (T_C) - - - - - - - −55°C to +125°C

intended Use: