MODUK - DEF STAN 81-83
Bonded Polyurethane Chipfoam
inactive
| Organization: | MODUK |
| Publication Date: | 14 June 1989 |
| Status: | inactive |
| Page Count: | 21 |
scope:
This Standard specifies requirements for four grades of bonded polyurethane chipfoam used as a resilient cushioning material for the packaging of fragile supplies. General requirements applicable to all bonded polyurethane chipfoam block, sheets and mouldings are given and specific physical requirements for densities of sheets commonly used for Services packaging.
This Standard does not cover special purpose oil-resistant and non-flammable polyurethane chipfoam.
Document History
May 28, 2022
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyether urethane chipfoam used as resilient cushioning material for the packaging of fragile supplies.
This Standard does not cover...
April 11, 2016
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyether urethane Chipfoam used as resilient cushioning material for the packaging of fragile supplies.
This Standard does not cover...
November 10, 2006
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyether urethane chipfoam used as resilient cushioning material for the packaging of fragile supplies.
This Standard does not cover...
November 7, 1997
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bondedpolyether urethane chipfoam used as resilient cushioning material for the packaging of fiagile supplies.
This Standard does not cover...
DEF STAN 81-83
June 14, 1989
Bonded Polyurethane Chipfoam
This Standard specifies requirements for four grades of bonded polyurethane chipfoam used as a resilient cushioning material for the packaging of fragile supplies. General requirements applicable to...