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SAE AMS2418

Plating, Copper

inactive
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Organization: SAE
Publication Date: 1 July 1998
Status: inactive
Page Count: 10
scope:

SCOPE:

Form:

This specification covers the requirements for electrodeposition of copper on metals and the properties of the deposit.

Application:

This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required or permitted, to prevent decarburization, to enhance solderability, or to provide a source of copper for furnace brazing, but usage is not limited to such applications.

Classification:

Plating covered by this specification is classified as follows:

Type 1 Engineering plating

Type 2 Plating for masking

Type 1 shall be supplied if no class is specified.

Document History

March 1, 2017
Plating, Copper
Form This specification covers the requirements for electrodeposited copper. Application This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
February 1, 2011
Plating, Copper
Form This specification covers the requirements for electrodeposited copper.  Application This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
January 1, 2006
Plating, Copper
Form: This specification covers the requirements for electrodeposited copper.  Application: This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces...
SAE AMS2418
July 1, 1998
Plating, Copper
SCOPE: Form: This specification covers the requirements for electrodeposition of copper on metals and the properties of the deposit. Application: This process has been used typically to provide an...
February 1, 1995
(R) Plating, Copper
A description is not available for this item.
April 1, 1986
COPPER PLATING
Form: This specification covers the engineering requirements for electrodeposition of copper on metals and the properties of the deposit. Application: Primarily to provide an anti-seize surface, to...
July 1, 1976
COPPER PLATING
Purpose: This specification covers the engineering requirements for electrodeposition of copper on metals and the properties of the deposit. Application: Primarily to provide an anti-seize...
April 15, 1967
COPPER PLATING
A description is not available for this item.
October 1, 1951
COPPER PLATING
A description is not available for this item.

References

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