IPC - TM-650 2.3.17.2B
Resin Flow of "No Flow" Prepreg
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 August 1997 |
| Status: | active |
| Page Count: | 3 |
scope:
This test method is designed to measure the Resin Flow of "no flow" prepreg used for bonding and adhesion without formation of resin bead as caused by flow of the resin.
Document History
TM-650 2.3.17.2B
August 1, 1997
Resin Flow of "No Flow" Prepreg
This test method is designed to measure the Resin Flow of "no flow" prepreg used for bonding and adhesion without formation of resin bead as caused by flow of the resin.
December 1, 1994
Resin Flow of "No Flow" Prepreg
A description is not available for this item.