scope:

This standard establishes the design requirements for Standard Electronic Modules (SEM) for the Standard Hardware Acquisition and Reliability Program (SHARP) for use in military systems. Other requirements for new module development are specified in MIL-M-28787 for the appropriate class selected to meet the system/equipment environmental requirements.

SEM shall be of the following classes and formats as specified in the detail specifications:

Classes Class I - For primary utilization in shipboard, subsurface ship, and shore applications. Module interface temperature, rib surfaces or inlet air, at 0°C low, and 60°C high. Class II - For primary utilization in airborne applications and where stringent environmental requirements are imposed. Module interface temperature, rib surfaces or inlet air, at minus 55°C low, and 85°C high. Class III - For utilization where class I modules may be exposed to radiation. Module interface temperature, rib surfaces or inlet air, at 0°C low, and 60°C high. Class IV - For utilization where class II modules may be exposed to radiation. Module interface temperature, rib surfaces or inlet air, at minus 55°C low, and 85°C high. Formats Format A - The basic size has a span of 2.62 inches (66.55 mm), a thickness of 0.290 inches (7.377 mm), and a total height of 1.95 inches (49.53 mm) including keying pins. Format B - The basic size has a span of 2.74 inches (69.59 mm), a thickness of 0.290 inches (7.377 mm), and a total height of 1.95 inches (49.53 mm) including keying pins. Format C - The basic size has a span of 5.88 inches (149.35 mm), a thickness of 0.280 inches (7.112 mm), and a total height of 4.06 inches (103.12 mm) including keying pins. Format D - The basic size has a span of 5.88 inches (149.35 mm), a thickness of 0.280 inches (7.112 mm), and a total height of 4.83 inches (122.68 mm), including keying pins. Format E - The basic size has a span of 5.88 inches (149.35 mm), a thickness of 0.380 inches (9.652 mm), and a total height of 6.68 inches (169.67 mm), including keying pins.

intended Use:

This standard contains design requirements for the design of standard electronic modules for use in military systems.