UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

DLA - MIL-C-55302/58E

CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)

inactive
Organization: DLA
Publication Date: 27 July 1979
Status: inactive
Page Count: 7

Document History

MIL-DTL-55302/58
April 15, 2021
Connectors, Printed Circuit Subassembly and Accessories: Receptacle, Socket Contacts, Decade Increments 10 thru 70 Contact Positions and Intermediate Positions of 14, 24, 44, 54 and 26, 36, 56, 66 for Printed Wiring Boards (.100 Spacing)
A description is not available for this item.
MIL-DTL-55302/58
June 21, 2016
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-DTL-55302/58
May 11, 2011
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-DTL-55302/58
February 3, 2004
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
January 5, 2000
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
September 28, 1998
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
September 23, 1992
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
This specification is approved for use by all Departments and Agencies of the Department of Defense. The requirements for aquiring the product described herein shall consist of this specification...
MIL-C-55302/58
August 26, 1988
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
August 13, 1985
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
December 26, 1984
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
February 15, 1980
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58E
July 27, 1979
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
September 1, 1976
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
January 20, 1976
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
October 18, 1974
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58A (1)
July 20, 1973
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58A
July 20, 1973
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
MIL-C-55302/58
December 8, 1972
CONNECTORS, PRINTED CIRCUIT SUBASSEMBLY AND ACCESSORIES: RECEPTACLE, SOCKET CONTACTS, DECADE INCREMENTS 10 THRU 70 CONTACT POSITIONS AND INTERMEDIATE POSITIONS OF 14, 24, 44, 54 AND 26, 36, 56, 66 FOR PRINTED WIRING BOARDS (.100 SPACING)
A description is not available for this item.
View Less
View All

References

This document references:
A581/A581M REV A - Standard Specification for Free-Machining Stainless Steel Wire and Wire Rods
November 1, 2022
This specification covers free-machining stainless steels of cold-finished wire and hot-finished wire rods in coils. Wire rods are a semi-finished product primarily for the manufacture of wire. Wire...
This document references:
A582/A582M - Standard Specification for Free-Machining Stainless Steel Bars
November 1, 2022
This specification covers hot-finished or cold-finished bars, except bars for forging (Note 1), suitable for machining processes. It includes rounds, squares, and hexagons in the more commonly used...
This document references:
ASTM B196/B196M - Standard Specification for Copper-Beryllium Alloy Rod and Bar
Published by ASTM on March 1, 2018
This specification establishes the requirements for copper-beryllium alloy rod and bar in straight lengths. The following three alloys are included: Unless otherwise required, Copper Alloy UNS No....
This document references:
B197/B197M - Standard Specification for Copper-Beryllium Alloy Wire
June 1, 2020
This specification establishes the requirements for copper-beryllium alloy wire in coils, spools, or other than straight lengths, of any uniform cross section. Copper Alloy UNS Nos. C17200 and...
This document references:
ASTM B488 - Standard Specification for Electrodeposited Coatings of Gold for Engineering Uses
Published by ASTM on August 1, 2018
This specification covers requirements for electrodeposited gold coatings that contain not less than 99.00 mass % gold and that are used for engineering applications. Specifically excluded from this...
View Less
View All
Advertisement