scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

Device type Generic number Circuit function 01 PAL22V10A 22-input 10-output registered AND-OR logic array 02 PAL22V10 22-input 10-output registered AND-OR logic array 03 PAL22VP10-25 22-input 10-output registered AND-OR logic array 04 PAL22V10-20 22-input 10-output registered AND-OR logic array 05 PAL22V10-12 22-input 10-output registered AND-OR logic array

The case outline(s) shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline K F-6 (24-lead, 0.640" × 0.420" × 0.090"), flat package L D-9 (24-lead, 1.280" × 0.310" × 0.200"), dual-in-line package 3 C-4 (28-terminal, 0.460" × 0.460" × 0.100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc Input voltage range - - - - - - - - - - - - - - - - −0.5 V dc to +5.5 V dc Output voltage applied - - - - - - - - - - - - - - - −0.5 V dc to +7.0 V dc 2/ Output sink current- - - - - - - - - - - - - - - - - +100 mA 2/ Thermal resistance, junction-to-case (θ_JC): Cases K, L, and 3- - - - - - - - - - - - - - - - - See MIL-M-38510, appendix C Maximum power dissipation (P_D) 3/ - - - - - - - - - 1.2 W Maximum junction temperature - - - - - - - - - - - - +175°C Lead temperature (soldering, 10 seconds maximum) - - +260°C

Supply voltage (V_CC) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc High level input voltage (V_IH) - - - - - - - - - - - 2.0 V dc minimum Low level input voltage (V_IL) - - - - - - - - - - - 0.8 V dc maximum

intended Use: