CENELEC - EN 60749-19
Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength
inactive
| Organization: | CENELEC |
| Publication Date: | 1 April 2003 |
| Status: | inactive |
| Page Count: | 10 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
April 1, 2003
Semiconductor devices – Mechanical and climatic test methods Part 19: Die shear strength
This part of IEC 60749 determines (see note) the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method,...
EN 60749-19
April 1, 2003
Semiconductor devices Mechanical and climatic test methods Part 19: Die shear strength
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