CENELEC - EN 61191-3
Printed Board Assemblies Part 3: Sectional Specification Requirements for Through-Hole Mount Soldered Assemblies
inactive
| Organization: | CENELEC |
| Publication Date: | 1 October 1998 |
| Status: | inactive |
| Page Count: | 20 |
| ICS Code (Electronics): | 31 |
Document History
September 1, 2017
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
EN 61191-3
October 1, 1998
Printed Board Assemblies Part 3: Sectional Specification Requirements for Through-Hole Mount Soldered Assemblies
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