scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 DAC8221A Dual 12-bit buffered multiplying CMOS D/A converter

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline L D-9 (24 lead, 1.280" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square leadless chip carrier package

V_DD to AGND - - - - - - - - - - - - - - - - - - - 0 V, +17 V V_DD to DGND - - - - - - - - - - - - - - - - - - - 0 V, +17 V AGND to DGND - - - - - - - - - - - - - - - - - - −0.3 V, V_DD +0.3 V Digital input voltage to DGND - - - - - - - - - - −0.3 V, V_DD +0.3 V I_OUTA, I_OUTB to AGND - - - - - - - - - - - - - - −0.3 V, V_DD +0.3 V V_REFA, V_REFB to AGND - - - - - - - - - - - - - - ±25 V V_RFBA, V_RFBB to AGND - - - - - - - - - - - - - - ±25 V Power dissipation (P_D) to +75°C - - - - - - - - - 500 mW 1/ Ambient operating temperature range - - - - - - - −55°C to +125°C Storage temperature (soldering, 60 sec) - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - See Mil-M-38510, appendix C Thermal resistance, junction-to-ambient (θ_JA): Case L - - - - - - - - - - - - - - - - - - - - 150°C Case 3 - - - - - - - - - - - - - - - - - - - - 110°C

Ambient operating temperature (T_A) - - - - - −55°C to +125°C V_REF - - - - - - - - - - - - - - - - - - - - +10 V_OUTA and V_OUTB - - - - - - - - - - - - - - - 0 V V_DD - - - - - - - - - - - - - - - - - - - - - +5 V or +15 V

intended Use: