scope:

This drawing forms a part of one part - one part number documentation system (see 6.6). Two product assurance classes, military high reliability (device classes B, Q, or M) and space application (device classes S or V) and a choice of case outlines and lead finishes are available and are reflected in the complete part number. When available, a choice of radiation hardness assurance (RHA) levels are reflected in the complete part number.

The PIN shall be as shown in the following example:

Device classes, M, B, or S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q or V devices shall meet or exceed the electrical performance characteristics specified in table I herein after exposure to the specified irradiation levels specified in the absolute maximum ratings herein and the RHA marked device shall be marked in accordance with MIL-I-38535. A dash (-) indicates a non-RHA device.

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 WE DSP-16 Digital signal processor, 16 bit

The device class designator shall be a single letter identifying the product assurance level (see 6.7 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

For device classes M, B, or S case outlines shall meet the requirements in appendix C of MIL-M-38510 and as listed below. For device classes Q or V case outline shall meet the requirements of MIL-I-38535, appendix C of MIL-M-38510, and as listed below.

Outline letter Case outline X P-AE (133 pin, 1.38" × 1.38" × .345"), pin grid array 1/

The lead finish shall be as specified in MIL-M-38510 for classes M, B, or S or MIL-I-38535 for classes Q or V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, or C are considered acceptable and interchangeable without preference.

Positive supply voltage - - - - - - - - - - - - - - - +6.0 V dc Negative supply voltage - - - - - - - - - - - - - - - −0.5 V dc Input voltage - - - - - - - - - - - - - - - - - - - - −0.5 V dc to 6.0 V dc Power dissipation (P_D) - - - - - - - - - - - - - - - - 350mW Storage temperature range - - - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - - - - See MIL-M-38510, appendix C Electrostatic discharge sensitivity (ESDS) - - - - - - Class 1 (1500 V) G-force - - - - - - - - - - - - - - - - - - - - - - - 20000 g

Case operating temperature range (T_C) - - - - - - - - −55°C to +125°C Supply voltages (V_DD) - - - - - - - - - - - - - - - - 4.5 V dc to 5.5 V dc Operating frequency range - - - - - - - - - - - - - - 1.0 MHz to 13.3 MHz

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - 80 percent

intended Use: