Plating, Lead and Indium
|Publication Date:||1 September 1996|
This specification covers the engineering requirements for electrodeposition of lead and indium and diffusion of the indium into the lead, and the properties of the deposit.
This process has been used typically to improve the performance and prevent corrosion of bearings or of other parts, but usage is not limited to such applications.
Safety - Hazardous Materials:
While the materials, methods, applications, and processes described or referenced in this specification may involve the use of hazardous materials, this specification does not address the hazards which may be involved in such use. It is the sole responsibility of the user to ensure familiarity with the safe and proper use of any hazardous materials and to take necessary precautionary measures to ensure the health and safety of all personnel involved.