TIA-455-71
FOTP-71 Procedure to Measure Temperature-Shock Effects on Fiber Optic Components
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| Organization: | TIA |
| Publication Date: | 1 October 1999 |
| Status: | inactive |
| Page Count: | 22 |
scope:
This procedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical fiber when specified for U.S. military or similar applications.
This procedure is specifically intended to measure and evaluate changes that may occur after exposure to a specified number of temperature-shock cycles. It is not intended to monitor product performance on a continuous or semicontinuous basis during temperature soaking.
The test for gradual temperature cycling, and monitoring during temperature excursions, is defined in FOTP-3.
Document History
October 1, 1999
FOTP-71 Procedure to Measure Temperature- Shock Effects on Fiber Optic Components
This procedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical...
TIA-455-71
October 1, 1999
FOTP-71 Procedure to Measure Temperature-Shock Effects on Fiber Optic Components
This procedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical...
October 1, 1999
FOTP-71 Procedure to Measure Temperature- Shock Effects on Fiber Optic Components
This procedure describes a method for conducting temperature-shock testing on fiber optic components such as connectors and branching devices. It may also be used for optical fiber cable or optical...
June 1, 1989
FOTP-71 Procedure to Measure Temperature-Shock Effects on Fiber Optic Components
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