scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54HCT154 4 to 16 line decoder

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline J D-3 (24-1ead, 1.290" × .610" × .225"), dual-in-line package K F-6 (24-lead, .640" × .420" × .090") flat package L D-9 (24-lead, 1.280 × .310 × .200") dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

Supply voltage (V_CC) - - - - - - - - - - - - - - - −0.5 V dc to +7 V dc Input voltage range, all inputs (V_IN)- - - - - - - −0.5 V dc to V_CC +0.5 V dc Output voltage range, all outputs (V_OUT) - - - - - −0.5 V dc to V_CC +0.5 V dc Clamp diode current, per pin (I_K)- - - - - - - - - ±20 mA Drain current, per output (I_OUT) - - - - - - - - - ±25 mA V_CC or ground current, per pin (I_CC) - - - - - - - ±50 mA Power dissipation per package (P_D) - - - - - - - - 500 mW 2/ Thermal resistance, junction-to-case (θ_JC): Cases J, K, L, and 3 - - - - - - - - - - - - - - See MIL-M-38510, appendix C Storage temperature (T_STG) - - - - - - - - - - - - −65°C to +150°C Lead temperature (soldering, 10 seconds) - - - - - +260°C

Supply voltage range (V_CC) - - - - - - - - - - - - 4.5 V dc to 5.5 V dc DC input or output voltage (V_IN, V_OUT) - - - - - - 0 V dc to V_CC Case operating temperature (T_C) - - - - - - - - - −55°C to +125°C Input rise and fall times t_r, t_f V_CC = 5.0 V- - - - - - - - - - - - - - - - - - - - 0 to 500 ns

intended Use: