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ASTM F533

STANDARD TEST METHOD FOR THICKNESS AND THICKNESS VARIATION OF SILICON SLICES

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Organization: ASTM
Publication Date: 31 October 1988
Status: inactive
Page Count: 4
ICS Code (Semiconducting materials): 29.045

Document History

December 10, 2002
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. This test method is intended primarily...
January 10, 2002
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. This test method is intended primarily...
June 10, 1996
Standard Test Method for Thickness and Thickness Variation of Silicon Wafers
1. Scope 1.1 This test method covers measurement of the thickness of silicon wafers, polished or unpolished, and estimation of the variation in thickness across the wafer. 1.2 This test method is...
September 28, 1990
STANDARD TEST METHOD FOR THICKNESS AND THICKNESS VARIATION OF SILICON SLICES
A description is not available for this item.
ASTM F533
October 31, 1988
STANDARD TEST METHOD FOR THICKNESS AND THICKNESS VARIATION OF SILICON SLICES
A description is not available for this item.
May 28, 1982
STANDARD TEST METHOD FOR THICKNESS AND THICKNESS VARIATION OF SILICON SLICES (R 1987) (E1-1987)
A description is not available for this item.
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