IPC - 7711 5.7.1

BGA/CSP Installation Using Wire Solder to Prefill Lands

inactive, Most Current
Organization: IPC
Publication Date: 1 February 1998
Status: inactive
Page Count: 2

Document History

7711 5.7.1
February 1, 1998
BGA/CSP Installation Using Wire Solder to Prefill Lands
A description is not available for this item.

References

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