IPC - 7711 5.7.1
BGA/CSP Installation Using Wire Solder to Prefill Lands
inactive, Most Current
| Organization: | IPC |
| Publication Date: | 1 February 1998 |
| Status: | inactive |
| Page Count: | 2 |
Document History
7711 5.7.1
February 1, 1998
BGA/CSP Installation Using Wire Solder to Prefill Lands
A description is not available for this item.