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IPC-CA-821

General Requirements for Thermally Conductive Adhesives

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Organization: IPC
Publication Date: 1 January 1995
Status: active
Page Count: 17
scope:

This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.

Document History

IPC-CA-821
January 1, 1995
General Requirements for Thermally Conductive Adhesives
This document covers requirements and test methods for paste type dielectric adhesives used to bond components in place and for their long term properties as a part of the printed wiring board.

References

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