IPC - TM-650 2.4.29B
Adhesion, Solder Mask Flexible Circuits
inactive
| Organization: | IPC |
| Publication Date: | 1 February 1988 |
| Status: | inactive |
| Page Count: | 1 |
Document History
March 1, 2007
Solder Mask - Adhesion to Flexible Circuits
This test method is used to determine the adhesion quality of solder masks used on flexible circuits.
TM-650 2.4.29B
February 1, 1988
Adhesion, Solder Mask Flexible Circuits
A description is not available for this item.