scope:

This European Specification specifies requirements for the exchange of data pertaining to bare semiconductor die with or without connection structures, and minimally-packaged semiconductor die. This specification also gives recommendations for general industry good practice for handling bare die, with or without connection structures and minimally-packaged die. ES 59008-5-3 specifies particular requirements and recommendations for minimally-packaged die (MPD) that are not contained elsewhere in this series of specifications. This specification is for use by semiconductor manufacturers, suppliers, die processors and users of semiconductor die. ES 59008-5-3 is to be read in conjunction with ES 59008-1, General requirements, with and ES 59008-3, Mechanical, material and connectivity requirements, and, where relevant, with ES 59008-4-1, ES 59008-4-2, ES 59008-4-3 and ES 59008-4-4.