scope:

This drawing forms a part of a one part - one part number documentation system (see 6.6 herein). Two product assurance classes consisting of military high reliability (device classes B, Q, and H) and space application (device classes S and V), and a choice of case outlines and lead finishes are available and reflected in the Part or Identifying Number (PIN). Device class M microcircuits represent non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices". When available, a choice of Radiation Hardness Assurance (RHA) levels are reflected in the PIN.

The PIN shall be as shown in the following example:

Device classes M, B, and S RHA marked devices shall meet the MIL-M-38510 specified RHA levels and shall be marked with the appropriate RHA designator. Device classes Q and V RHA marked devices shall meet the MIL-I-38535 specified RHA levels and shall be marked with the appropriate RHA designator. A dash(-) indicates a non-RHA device.

The device type(s) shall identify the circuit function as follows:

DRAM SAM Device type Generic number 1/ Circuit function Access time Access time 01 256K × 4, multiport video RAM 120 ns 35 ns 02 256K × 4, multiport video RAM 100 ns 30 ns

The device class designator shall be a single letter identifying the product assurance level (see 6.7 herein) as follows:

Device class Device requirements documentation M Vendor self-certification to the requirements for non-JAN class B microcircuits in accordance with 1.2.1 of MIL-STD-883 B or S Certification and qualification to MIL-M-38510 Q or V Certification and qualification to MIL-I-38535

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style T See figure 1 28 "J" lead chip carrier U CDFP4-F28 28 Flat pack X See figure 1 28 Dual-in-Line Y See figure 1 28 "J" lead chip carrier Z See figure 1 28 Rectangular leadless chip carrier

The lead finish shall be as specified in MIL-M-38510 for classes M, B, and S or MIL-I-38535 for classes Q and V. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

Voltage range on any pin except DQ and SDQ - - - - - - - - −1 V dc to 7 V dc Voltage. range on DQ and SDQ - - - - - - - - - - - - - - - −1 V dc to V_CC Voltage range on V_CC - - - - - - - - - - - - - - - - - - - 0 V dc to 7 V dc Short circuit output current (per output) - - - - - - - - 50 mA Power dissipation (P_D) - - - - - - - - - - - - - - - - - - 1 W Storage temperature range - - - - - - - - - - - - - - - - −65°C to 150°C Lead temperature (soldering, 10 seconds) - - - - - - - - - +300°C Thermal resistance, junction-to-case (θ_JC): Case U - - - - - - - - - - - - - - - - - - - - - - - - - See MIL-STD-1835 Cases X, Y, Z, and T - - - - - - - - - - - - - - - - - - 10°C/W 3/ Junction temperature (T_J) 4/ - - - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) 5/ - - - - - - - - - - - - - - +4.5 V dc to +5.5 V dc Supply voltage (V_SS) - - - - - - - - - - - - - - - - - - - 0.0 V dc High level input voltage range (V_IH) - - - - - - - - - - - 2.9 V dc to 0.6 V dc Low level input voltage range (V_IL) 6/- - - - - - - - - - −1.0 V dc to 0.6 V dc System transition times, rise and fall (t_t) - - - - - - - 3 ns to 50 ns Case operating temperature range (T_C) - - - - - - - - - - −55°C to +125°C

Fault coverage measurement of manufacturing logic tests (MIL-STD-883, test method 5012) - - - - - - 7/ percent

intended Use: