IPC - TM-650 2.4.47
Flux Residue Dryness
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 2 |
scope:
This test method specifies a qualitative method for assessment of the tackiness of soft soldering flux residues. The method is applicable to fluxes of types L and M. the method is particularly appropriate for applications where flux residues are left in place on soldered electronic and electrical equipment.
Document History
TM-650 2.4.47
January 1, 1995
Flux Residue Dryness
This test method specifies a qualitative method for assessment of the tackiness of soft soldering flux residues. The method is applicable to fluxes of types L and M. the method is particularly...