IPC - J-STD-027
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
active, Most Current
Buy Now
| Organization: | IPC |
| Publication Date: | 1 February 2003 |
| Status: | active |
| Page Count: | 20 |
scope:
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
Purpose The purpose of this standard is to establish a family of mechanical outlines and footprints for both the device and the interconnection scheme. Interconnection ball/bump/land size, pitch, configuration, coplanarity, and associated tolerances are included in this standard.
Document History
J-STD-027
February 1, 2003
Mechanical Outline Standard for Flip Chip and Chip Size Configurations
This standard establishes mechanical outline requirements for devices supplied in flip chip or Chip Size Package (CSP) formats, including die surface, die terminals, and interconnection...