CENELEC - HD 307.3.1 S1
Specification for Solventless Polymerisable Resinous Compounds Used for Electrical Insulation- Part 3: Specifications for Individual Materials. Sheet one: Unfilled Epoxy Resinous Compounds
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 January 1989 |
| Status: | active |
| Page Count: | 3 |
| ICS Code (Electrical engineering): | 29 |
Document History
HD 307.3.1 S1
January 1, 1989
Specification for Solventless Polymerisable Resinous Compounds Used for Electrical Insulation- Part 3: Specifications for Individual Materials. Sheet one: Unfilled Epoxy Resinous Compounds
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