scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54AS756 Octal buffer and line driver with open-collector outputs

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline R D-8 (20-lead, 1.060" × .310" × .200"), dual-in-line package S F-9 (20-lead, .540" × .300" × .100"), flat package 2 C-2 (20-terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - −0.5 V dc minimum to +7.0 V dc maximum Input voltage range- - - - - - - - - - - - - - - −1.2 V dc at −18mA to +7.0 V dc Maximum power dissipation (P_D) - - - - - - - - - 517 mW Storage temperature range- - - - - - - - - - - - −65°C to +150° C Lead temperature (soldering, 10 seconds) - - - - +300°C Thermal resistance, junction-to-case (θ_JC) - - - See MIL-M-38510, appendix C Junction temperature (T_J)- - - - - - - - - - - - +175°C

Supply voltage (V_CC) - - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage V_IH)- - - - - - 2.0 V dc Maximum low level input voltage (V_IL)- - - - - - 0.8 V dc High level output voltage (V_OH)- - - - - - - - - 5.5 V Case operating temperature range (T_C)- - - - - - −55°C to ±125°C

intended Use: