IPC - TM-650 2.4.45
Solder Paste - Wetting Test
active, Most Current
| Organization: | IPC |
| Publication Date: | 1 January 1995 |
| Status: | active |
| Page Count: | 1 |
scope:
Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow.
Document History
TM-650 2.4.45
January 1, 1995
Solder Paste - Wetting Test
Determine the ability of a solder paste to wet an oxidized copper surface and to qualitatively examine the amount of spatter of the solder paste during reflow.