scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete PIN shall be as shown in the following example:

The device type(s) shall identify the circuit function as follows:

The case outline(s) shall be as designated in MIL-STD-1835 and as follows:

Outline letter Descriptive designator Terminals Package style P GDIP1-T8 or CDIP2-T8 8 Dual-in-line

The lead finish shall be as specified in MIL-M-38510. Finish letter "X" shall not be marked on the microcircuit or its packaging. The "X" designation is for use in specifications when lead finishes A, B, and C are considered acceptable and interchangeable without preference.

(Unless otherwise specified, T_A = +25°C)

Positive supply voltage (+V_S) . . . . . . . . . . . . . . +18 V dc Negative supply voltage (−V_S) . . . . . . . . . . . . . . −18 V dc Differential input voltage . . . . . . . . . . . . . . . ±6.0 V dc Input common mode voltage . . . . . . . . . . . . . . . . ±V_S Storage temperature range . . . . . . . . . . . . . . . . −65°C to +150°C Power dissipation (P_D) 1/ . . . . . . . . . . . . . . . . 1.1 W Lead temperature (soldering, 10 seconds) . . . . . . . . +300°C Thermal resistance, junction-to-case (Θ_JC) . . . . . . . See MIL-STD-1835 Thermal resistance, junction-to-ambient (Θ_JC) . . . . . . 110°C/W Junction temperature (T_J) . . . . . . . . . . . . . . . . +175°C

Positive supply voltage range (+V_S) . . . . . . . . . . . +4.5 V dc to +15 V dc Negative supply voltage range (−V_S) . . . . . . . . . . . −4.5 V dc to −15 V dc Common mode input voltage (V_CM) . . . . . . . . . . . . . ±12 V dc Ambient operating temperature range (T_A) . . . . . . . . −55°C to +125°C

intended Use: