IPC - TM-650 2.5.8 PROPOSAL A
Dissipation Factor of Flexible Printed Wiring Material
inactive
| Organization: | IPC |
| Publication Date: | 1 July 1975 |
| Status: | inactive |
| Page Count: | 1 |
Document History
July 1, 1975
Dissipation Factor of Flexible Printed Wiring Material
This test method provides a standard procedure to determine the dissipation factor of printed circuit materials.
TM-650 2.5.8 PROPOSAL A
July 1, 1975
Dissipation Factor of Flexible Printed Wiring Material
A description is not available for this item.