scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 54ALS174 Hex D-type flip-flop with clear 02 54ALS175 Quad D-type flip-flop with clear

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package F F-5 (16-lead, .440" × .285" × .085"), flat package 2 C-2 (20 terminal, .358" × .358" × .100"), square chip carrier package

Supply voltage range - - - - - - - - - - - - - - - −0.5 V dc minimum to +7.0 V dc maximum Input voltage range - - - - - - - - - - - - - - - −1.5 V dc at −18 mA to +7.0 V dc Storage temperature range - - - - - - - - - - - - −65°C to +150°C Maximum power dissipation (P_D) per device 1/: Device type 01 - - - - - - - - - - - - - - - - - 104.5 mW Device type 02 - - - - - - - - - - - - - - - - - 77 mW Lead temperature (soldering, 10 seconds) - - - - - +300°C Thermal resistance, junction-to-case (θ_JC): - - - - See MIL-M-38510, appendix C Junction temperature (T_J) - - - - - - - - - - - - +175°C

Supply voltage range (V_CC) - - - - - - - - - - - - - +4.5 V dc minimum to +5.5 V dc maximum Minimum high level input voltage (V_IH) - - - - - - - 2.0 V dc Maximum low level input voltage (V_IL): T_C = +125°C - - - - - - - - - - - - - - - - - - - - 0.7 V dc T_C= −55°C - - - - - - - - - - - - - - - - - - - - 0.8 V dc T_C= +25°C - - - - - - - - - - - - - - - - - - - - 0.8 V dc Normalized fanout (each output) 2/ - - - - - - - - - 10 maximum at low logic level 20 maximum at high logic level Case operating temperature range - - - - - - - - - - −55°C to +125° C

intended Use: