scope:

This drawing describes device requirements for class B microcircuits in accordance with 1.2.1 of MIL-STD-883, "Provisions for the use of MIL-STD-883 in conjunction with compliant non-JAN devices".

The complete part number shall be as shown in the following example:

The device type shall identify the circuit function as follows:

Device type Generic number Circuit function 01 RM3182 Bus interface line driver circuit

The case outlines shall be as designated in appendix C of MIL-M-38510, and as follows:

Outline letter Case outline E D-2 (16-lead, .840" × .310" × .200"), dual-in-line package 3 C-4 (28-terminal, .460" × .460" × .100"), square chip carrier package

V+ minus V− (differential voltage) - - - - - - - - - - 40 V dc V₁ - - - - - - - - - - - - - - - - - - - - - - - - - - 7 V dc V_REF - - - - - - - - - - - - - - - - - - - - - - - - - 6 V dc Logic input voltage range - - - - - - - - - - - - - - (GND - 0.3 V) to (V₁ + 0.3 V) Maximum power dissipation (P_D): Case outline E - - - - - - - - - - - - - - - - - - - 1.725 W 1/ Case outline 3 - - - - - - - - - - - - - - - - - - - 1.12 W 1/ Lead temperature (soldering, 10 seconds) - - - - - - - +275°C Storage temperature range- - - - - - - - - - - - - - - −65°C to +150°C Thermal resistance, junction-to-case (θ_JC) - - - - - - See MIL-M-38510, appendix C Junction-to-ambient (θ_JA): Case outline E - - - - - - - - - - - - - - - - - - - 86.5°C/W Case outline 3 - - - - - - - - - - - - - - - - - - - 133.7°C/W Junction temperature - - - - - - - - - - - - - - - - - +175°C

Supply voltages: V+ - - - - - - - - - - - - - - - - - - - - - - - - - 15 V dc ±10% V− - - - - - - - - - - - - - - - - - - - - - - - - - −15 V dc ±10% V₁ - - - - - - - - - - - - - - - - - - - - - - - - - 5 V dc ±5% V_REF - - - - - - - - - - - - - - - - - - - - - - - - 5 V dc ±5% Case operating temperature range (T_C)- - - - - - - - - −55°C to +125°C Maximum load: Data rate at 12.5 KBPS: R_L = 800Ω, C_L = 30 nF; R_L = 400Ω, C_L = 6.9 nF. Data rate at 100 KBPS: R_L = 800Ω, C_L = 4 nF.

intended Use: